Ultra Fine Wire Diamond Die

Our Ultra Fine Wire Diamond Die is a high-precision tool engineered specifically for the reliable and consistent drawing of ultra-fine wires—typically ranging from 50 micrometers down to less than 1 micrometer in diameter. Constructed with a natural diamond or polycrystalline diamond (PCD) orifice, meticulously shaped and polished to nanometer-level surface smoothness, this die ensures exceptional roundness, dimensional stability, and surface finish in the most demanding micro-wire applications.

Designed for use with highly conductive and sensitive materials such as copper, gold, silver, aluminum, platinum, and specialty alloys, the die enables high-speed, continuous production without wire breakage, surface scratches, or diameter variation. The unparalleled hardness and thermal conductivity of diamond minimize wear and heat buildup, ensuring long service life and stable drawing performance over extended runs.

This die is essential in advanced industries including semiconductor packaging, medical guidewires and implants, aerospace sensors, precision resistors, fiber optic components, and high-frequency communication cables—where even minor imperfections can compromise functionality.

Each Ultra Fine Wire Diamond Die is custom-engineered with optimized inlet geometry, bearing length, and exit angle to suit specific material types, reduction ratios, and line speeds. Manufactured under strict cleanroom conditions and verified with high-resolution optical and laser metrology systems, our dies meet the highest standards of quality and repeatability.

For manufacturers pushing the limits of miniaturization and performance, our Ultra Fine Wire Diamond Die delivers the precision, reliability, and longevity required to excel in next-generation micro-wire production.