Diamond Micro Wire Drawing Die

Our Diamond Micro Wire Drawing Die is a high-precision tool specifically engineered for the production of ultra-fine wires with diameters ranging from a few micrometers down to sub-micron levels. Featuring a natural diamond or polycrystalline diamond (PCD) bore meticulously formed and polished to atomic-level smoothness, this die delivers exceptional dimensional accuracy, roundness, and surface integrity—critical for advanced applications in microelectronics, medical devices, aerospace sensors, and fiber optics.

The extreme hardness and wear resistance of diamond ensure long service life and stable performance, even when drawing challenging materials such as gold, silver, platinum, copper, tungsten, and specialty alloys under high reduction ratios. The ultra-smooth bore minimizes friction, prevents wire breakage, and eliminates surface defects, enabling consistent production of high-purity, high-strength micro wires.

Each die is custom-designed with optimized geometry—including precise inlet angles, bearing length, and exit profiles—to match specific material properties, target diameters, and drawing speeds. Advanced metrology and laser-based inspection guarantee micron- or sub-micron-level conformity to specifications.

Widely trusted in high-tech industries where reliability at microscopic scales is non-negotiable, our Diamond Micro Wire Drawing Die combines cutting-edge material science with precision engineering to meet the evolving demands of next-generation wire manufacturing.