Diamond Micro Wire Die Manufacturer

The Diamond Micro Wire Die is a high-precision drawing tool engineered for the production of ultra-fine metal wires—typically from 100 micrometers down to below 1 micrometer in diameter. At its core is a meticulously shaped and mirror-polished diamond orifice, made from either natural diamond or polycrystalline diamond (PCD), offering exceptional hardness, wear resistance, and thermal conductivity.

This die ensures outstanding wire roundness, surface smoothness, and dimensional consistency, making it ideal for drawing high-purity and high-value materials such as copper, gold, silver, platinum, aluminum, tungsten, and specialty alloys used in sensitive applications. The ultra-smooth diamond bore minimizes friction and material adhesion, significantly reducing wire breakage and enabling stable, high-speed drawing over extended production cycles.

Widely used in industries where miniaturization and reliability are paramount—including medical devices (e.g., implantable leads, micro-catheters), semiconductor packaging (bonding wires), aerospace sensors, precision resistors, and fiber optic components—the Diamond Micro Wire Die delivers the performance required for next-generation micro-engineered systems.

Each die can be customized with precise inlet angles, bearing lengths, and exit geometries to match specific material behavior and process parameters. Manufactured under stringent quality controls and verified with advanced metrology tools, our Diamond Micro Wire Dies provide unmatched accuracy, longevity, and repeatability for the most demanding fine-wire manufacturing challenges.