Custom Diamond Micro Wire Drawing Die

Our Custom Diamond Micro Wire Drawing Die is a high-precision, application-specific tool designed for the production of ultra-fine wires with diameters typically ranging from 100 micrometers down to sub-micron levels. Engineered to meet exact customer requirements, each die features a natural diamond or polycrystalline diamond (PCD) bore—precision-lapped and polished to atomic-level smoothness—to ensure flawless wire surface quality, perfect roundness, and consistent dimensional accuracy.

Tailored for drawing delicate and high-value materials such as gold, silver, copper, platinum, tungsten, nickel alloys, and specialty conductive wires, these custom dies are optimized for specific reduction ratios, feed speeds, lubrication conditions, and material properties. Every geometric parameter—including inlet angle, bearing length, exit profile, and hole diameter—is meticulously designed in collaboration with the customer to maximize drawing efficiency, minimize breakage, and extend tool life.

These dies are indispensable in cutting-edge industries such as medical device manufacturing (e.g., guidewires, neurostimulation leads), microelectronics (bonding wires, fine-pitch interconnects), aerospace sensors, fiber optics, and quantum computing components—where tolerances are measured in nanometers and reliability is critical.

Manufactured using advanced laser drilling, CNC contouring, and ultra-precision polishing techniques under controlled cleanroom environments, our Custom Diamond Micro Wire Drawing Dies undergo rigorous inspection via interferometry, SEM, and optical profilometry to guarantee conformity to exact specifications.

Whether you require a single prototype or batch production, we provide full engineering support—from design consultation to performance validation—ensuring a solution that delivers unmatched precision, durability, and process stability for your most challenging micro-wire applications.